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Conference at PACK EXPO 2008 Speaker Application Form

Applications are now being accepted for the Conference at PACK EXPO to be held at McCormick Place, Chicago, Ill. on November 10-12, 2008. This conference will be held in conjunction with PACK EXPO International, November 9-13 in Chicago.

The deadline for submissions is Friday, March 28, 2008. All presentations will be reviewed by the Conference at PACK EXPO Program Advisory Board chaired by Ben Miyares, vice president of Industry Relations at PMMI.

All applicants will be notified of the approval/rejection/waitlisting of their proposal via e-mail on Monday, April 28, 2008.

* = Required
* Prefix
* Name
* Title
* Organization
* Street Address
* City
* State/Province
* Postal/Zip Code
* Country
* E-mail
* Confirm E-mail
* Phone Number
  ADDITIONAL PANELISTS:
  Prefix
  Name
  Title
  Organization
  Street Address
  City
  State/Province
  Postal/Zip Code
  Country
  E-mail
  Phone Number
  Prefix
  Name
  Title
  Organization
  Street Address
  City
  State/Province
  Postal/Zip Code
  Country
  E-mail
  Phone Number
* Have you spoken previously at the Conference at PACK EXPO?
  Yes No     List the year(s) you presented:
* How long have you been involved with the packaging industry? (check one)
  under 1 year 1-5 years 5-10 years 10-20 years 20+ years
* Presentation Subject (helps with developing tracks):
 
* Presentation Title:
* Presentation Abstract:
(Presentation abstracts may be submitted in MS Word or PDF format 100 word maximum)
* Biography:
(Biographical information may be submitted in MS Word or PDF format 200 word maximum)
  Headshot:
(Images must be high resolution, 300 dpi, JPG format only, suitable for printing )