The Chuck Yuska Scholarship was established for PMMI’s former President & CEO of 28 years. Mr. Yuska was an influential force in growing PMMI and the association’s trade show, PACK EXPO, representing innovation in the packaging industry.

Criteria:

• Currently attending a PMMI Partner School
• Academic Achievement: GPA 3.0 or higher
• Area of study: Engineering, packaging, processing, mechatronics, or related field

The scholarship was established in memory of the founding publisher of Automation World magazine, David Harvey, to honor him and his contributions to field he served for over three decades. 

The David A. Harvey Memorial Scholarship was established to encourage and support the growth of careers in industrial automation. The scholarship benefits educational institutions that prepare students for employment in manufacturing and automation. 

The recipient of the David Harvey Scholarship will be selected by the PMMI Foundation. There is no application for this scholarship.

This scholarship in the amount of $5,000 is awarded to one student attending a 4-year PMMI Partner School with a focus on electrical engineering

Criteria:

• Currently enrolled at a PMMI Partner School
• Major in electrical engineering
• Academic Achievement: GPA 3.0 or higher
• Awards & Recognition
• Internship/industry involvement

Established in honor of Packaging Hall of Famer and longtime Enercon Industries Corporation Employee Bill Zito. Enercon is a PMMI Member Company that supplies induction cap sealers,  corona treaters, and plasma surface treaters. Bill Zito was an active PMMI member and strongly believed in the importance of education in the packaging field.

The Enercon Bill Zito scholarship will be awarded to the candidate who best meets the following criteria:

• Third year student majoring in packaging engineering or related areas.
• Excellent academic achievement plus recommendation from faculty.
• Essay from student demonstrating interest in packaging industry.
• Extra-curricular involvement.
• Candidate should submit resume outlining academic and work experience along with essay.

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Packaging World’s Future Leaders in Packaging Scholarship was established in 2011 in conjunction with Leaders in Packaging – a print and online marketing program that enables suppliers to promote their innovation and expertise to the packaging community.

This scholarship of $5,000 is award each year to a student attending a 4-year PMMI Partner School that prepares students for careers in packaging.  

The recipient of the Future Leaders in Packaging Scholarship will be selected by the PMMI Foundation. There is no application for this scholarship.

Established in memory of former president and CEO of the Garvey Corporation, a PMMI Member Company. Mark Garvey was a past chairman of PMMI and a long-time supporter of packaging education. He gave significant time and effort to technical schools in the United States and Canada.

Each fall, the Garvey Family awards the scholarship to one PMMI Partner School that demonstrates a commitment to excellence in the packaging industry. The school selects a student to receive the award, following this criteria:

• Academic Achievement: GPA 3.0 or higher
• Major in packaging engineering or related field
• Demonstrated commitment to excellence in the packaging industry
• Demonstrated extracurricular involvement

There is no application or deadline for this scholarship.

This scholarship in the amount of $5,000 is awarded to one student attending a 4-year PMMI Partner School with a focus on mechanical engineering or mechanical engineering technology.

Criteria:

• Currently enrolled at a PMMI Partner School
• Major in mechanical engineering
• Academic Achievement: GPA 3.0 or higher
• Awards & Recognition
• Internship/industry involvement

The PACK EXPO Scholarship is the beneficiary of PMMI’s PACK Gives Back events at PACK EXPO International and PACK EXPO Las Vegas.  The scholarship provides six $5,000 scholarships for students attending partner schools. 

The winners will be announced at the PACK Gives Back event at PACK EXPO.

Criteria:

• Currently attending a PMMI Partner School
• Academic Achievement: GPA 3.0 or higher
• Area of study: Engineering, packaging, processing, mechatronics, or related field

The PMMI Member Family Scholarship supports immediate family members of PMMI member company employees who are interested in packaging and processing as a career choice. These $5,000 scholarships will be awarded annually to the top fifteeen applicants. 

Candidates for the PMMI Member Family Scholarship must:

• Be an employee or immediate family member (parent, child, step-child, sibling or spouse) of an employee at a member company that is in good standing with PMMI, The Association for Packaging and Processing Technologies
• Student must be enrolled in at an accredited 2 or 4 year college, university, or vocational/technical school in North America with a course of study relevant to a business or business-related field with preference given to mechatronics, packaging, or processing curriculum (Please Note: This scholarship does not require the educational institute to be a PMMI Partner School.) 
• Academic Achievement: GPA of 3.0 or higher

Established in memory of Claude Breeden, Glenn Davis and Art Schaefer. All of whom were industry leaders and committed to education and workforce development. 

Scholarships in the amount of $4,000 are awarded to students attending a 2-year PMMI Partner School.

Criteria:

• Currently enrolled in a 2-year program at a PMMI Partner School
• Academic Achievement: GPA 3.0 or higher
• Plans for a career in packaging/processing machinery manufacturing
• Awards & Recognition
• Internship/industry involvement

This scholarship in the amount of $5,000 is awarded to one student attending a 4-year PMMI Processing Partner School.

Criteria:

• Currently enrolled at a PMMI Partner School
• Demonstrated commitment to excellence in the processing industry
• Academic Achievement: GPA 3.0 or higher

Established in memory of former president and CEO of Dorner Manufacturing Corporation, a PMMI Member Company. Richard was an active leader in the industry and had a passion for learning.

Winner will be selected by Dorner Manufacturing Corporation

Criteria:

• Currently attending a PMMI Partner School
• Academic Achievement: GPA 3.0 or higher
• Major in packaging engineering or related field
• Demonstrated commitment to excellence in the packaging industry
• Demonstrated extracurricular involvement