Scholarships

PMMI Scholarships

Each year the PMMI Foundation provides over $200,000 in scholarships to students attending PMMI Partner Schools. These scholarships underscore PMMI’s commitment to the future of the packaging and processing industry.

2019 Application deadline:  March 1, 2019

Application components include:

  • Completed online application including essay questions
  • Copy of your transcripts
  • Faculty recommendation

Individual Student Scholarships

Established in memory of Claude Breeden, Glenn Davis and Art Schaefer. All of whom were industry leaders and committed to education and workforce development. 

Scholarships in the amount of $4,000 are awarded to students attending a 2-year PMMI Partner School.

Criteria:

  • Currently enrolled in a 2-year program at a PMMI Partner School
  • Academic Achievement: GPA 3.0 or higher
  • Plans for a career in packaging/processing machinery manufacturing
  • Awards & Recognition
  • Internship/industry involvement

The PACK EXPO Scholarship is the beneficiary of PMMI’s PACK Gives Back events at PACK EXPO International and PACK EXPO Las Vegas.  The scholarship provides six $5,000 scholarships for students attending partner schools. 

The winners will be announced at the PACK Gives Back event at PACK EXPO.

Criteria:

  • Currently attending a PMMI Partner School
  • Academic Achievement: GPA 3.0 or higher
  • Area of study: Engineering, packaging, processing, mechatronics, or related field

This scholarship in the amount of $5,000 is awarded to one student attending a 4-year PMMI Partner School with a focus on electrical engineering

Criteria:

  • Currently enrolled at a PMMI Partner School
  • Major in electrical engineering
  • Academic Achievement: GPA 3.0 or higher
  • Awards & Recognition
  • Internship/industry involvement

This scholarship in the amount of $5,000 is awarded to one student attending a 4-year PMMI Partner School with a focus on mechanical engineering.

Criteria:

  • Currently enrolled at a PMMI Partner School
  • Major in mechanical engineering
  • Academic Achievement: GPA 3.0 or higher
  • Awards & Recognition
  • Internship/industry involvement

This scholarship in the amount of $5,000 is awarded to one student attending a 4-year PMMI Processing Partner School.

Criteria:

  • Currently enrolled at a PMMI Partner School
  • Demonstrated commitment to excellence in the processing industry
  • Academic Achievement: GPA 3.0 or higher

Established in memory of former president and CEO of the Garvey Corporation, a PMMI Member Company. Mark Garvey was a past chairman of PMMI and a long-time supporter of packaging education. He gave significant time and effort to technical schools in the United States and Canada.

Each fall, the Garvey Family awards the scholarship to one PMMI Partner School that demonstrates a commitment to excellence in the packaging industry. The school selects a student to receive the award, following this criteria:

  • Academic Achievement: GPA 3.0 or higher
  • Major in packaging engineering or related field
  • Demonstrated commitment to excellence in the packaging industry
  • Demonstrated extracurricular involvement

There is no application or deadline for this scholarship.

The scholarship was established in memory of the founding publisher of Automation World magazine, David Harvey, to honor him and his contributions to field he served for over three decades. 

The David A. Harvey Memorial Scholarship was established to encourage and support the growth of careers in industrial automation. The scholarship benefits educational institutions that prepare students for employment in manufacturing and automation. 

The recipient of the David Harvey Scholarship will be selected by the PMMI Foundation. There is no application for this scholarship.

Established in memory of former president and CEO of Dorner Manufacturing Corporation, a PMMI Member Company. Richard was an active leader in the industry and had a passion for learning.

Winner will be selected by Dorner Manufacturing Corporation

Criteria:

  • Currently attending a PMMI Partner School
  • Academic Achievement: GPA 3.0 or higher
  • Major in packaging engineering or related field
  • Demonstrated commitment to excellence in the packaging industry
  • Demonstrated extracurricular involvement

 

Established in honor of Packaging Hall of Famer and longtime Enercon Industries Corporation Employee Bill Zito. Enercon is a PMMI Member Company that supplies induction cap sealers,  corona treaters, and plasma surface treaters. Bill Zito was an active PMMI member and strongly believed in the importance of education in the packaging field.

2018 Application deadline: December 01, 2018

Winner will be selected biannually by Enercon Industries.

Criteria:

  • Currently attending a PMMI Partner School
  • Academic Achievement: GPA 3.0 or higher
  • Major in packaging engineering or related field
  • Demonstrated commitment to excellence in the packaging industry
  • Demonstrated extracurricular involvement

Application components include:

  • Write a 500-1,000 word essay describing your interest in the packaging field and your career goals
  • Obtain your transcripts from a PMMI Partner School, indicating your current GPA and extracurricular involvement (see Criteria)
  • Obtain a faculty recommendation

Packaging World’s Future Leaders in Packaging Scholarship was established in 2011 in conjunction with Leaders in Packaging – a print and online marketing program that enables suppliers to promote their innovation and expertise to the packaging community.

This scholarship of $5,000 is award each year to a student attending a 4-year PMMI Partner School that prepares students for careers in packaging.  

The recipient of the Future Leaders in Packaging Scholarship will be selected by the PMMI Foundation. There is no application for this scholarship.

Additional Funds

PACK EXPO Travel Assistance

Each year PMMI provides over $60,000 in travel assistance to PMMI Partner Schools wishing to attend PACK EXPO. PMMI provides money to help cover students’ accommodation and transportation costs. 

PMMI Partner Schools are invited to apply for travel assistance. Amount awarded will depend on total requests received with preference given to those participating in the Amazing Packaging Race and NextGEN Networking Fair. Total per student will not exceed $250 and funds must be used for student travel to PACK EXPO.

To Apply

Contact Jill Davis, Education Program Coordinator, jdavis@pmmi.org.

Questions?

For more information on the PMMI Scholarship program, contact

Name: Jill Davis
Title: Education Program Coordinator
Email: jdavis@pmmi.org
Phone: 571-287-6810

Become A Partner School

To find out how your school can become a PMMI Partner School, contact:

Name: Kate Fiorianti
Title: Education Manager
Email: kate@pmmi.org
Phone: 571-266-4406