PMMI Foundation Awards $30,000 in PACK EXPO Scholarships to Six Students

Herndon, Virginia; Oct. 19, 2026 — The PMMI Foundation, the charitable arm of PMMI, The Association for Packaging and Processing Technologies, has awarded $30,000 in PACK EXPO Scholarships to six students pursuing careers in packaging and processing-related fields.

Each recipient will receive a $5,000 scholarship to support their education as they prepare for careers in industries that increasingly rely on engineering, automation, packaging, and advanced manufacturing expertise.

The 2026 recipients represent universities across the United States and a range of disciplines, including mechanical engineering, engineering, packaging science, and packaging engineering.

“Supporting students as they develop the technical skills and expertise our industry needs is one of the most important investments we can make in its future,” says Jim Pittas, president and CEO, PMMI. “This year’s PACK EXPO Scholarship recipients represent an impressive range of disciplines and educational paths, and we are proud to support them as they take the next steps toward careers that will help shape the future of packaging and processing.”

The 2026 PACK EXPO Scholarship Recipients:

Bryant Hales, Brigham Young University–Idaho, Mechanical Engineering

Delilah Assefa, James Madison University, Engineering

Emily Neale, Clemson University, Packaging Science

Eric Dalangin, Rutgers University–New Brunswick, Packaging Engineering

Hyrum Woolsey, Brigham Young University–Idaho, Mechanical Engineering

Roberto Montiel, University of Georgia, Mechanical Engineering

Building the Industry’s Future Workforce

The PACK EXPO Scholarship program is part of the PMMI Foundation’s broader commitment to strengthening the packaging and processing workforce by supporting students pursuing education and careers relevant to the industry.

Beyond providing financial assistance, PMMI Foundation initiatives help build connections between education and industry, increase awareness of career opportunities, and encourage emerging talent to bring their skills to packaging, processing, manufacturing, and related fields.

The six recipients will be recognized during PACK gives BACK™ at PACK EXPO International 2026, taking place Oct. 18–21 at McCormick Place in Chicago.

Each year, the PMMI Foundation provides more than $200,000 in scholarships to students preparing to enter the packaging and processing industries.

For more information about PMMI Foundation scholarships and scholarship recipients, visit PMMIFoundation.org.

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