Team 26 Races to Victory in the 2026 Amazing Packaging Race at PACK EXPO International

Herndon, Va; Oct. 26, 2026 — Team 26 raced to first place in the 2026 Amazing Packaging Race at PACK EXPO International, outpacing 30 teams in a show-floor competition that challenged college students to apply their engineering knowledge, problem-solving skills, and teamwork to real-world packaging and processing scenarios.

Organized by PMMI, The Association for Packaging and Processing Technologies, and sponsored by SICK, Sensor Intelligence, the Amazing Packaging Race brought together 104 students from 15 colleges and universities for a fast-paced competition spanning the PACK EXPO International show floor in Chicago on October 21.

Teams raced between participating exhibitor booths, where they completed a series of challenges based on real-world manufacturing scenarios. Along the way, students interacted directly with packaging and processing technologies and the companies behind them, putting classroom knowledge into practice while gaining firsthand exposure to the industry.

Team 26 stood out for its ability to quickly solve challenges, work effectively as a team, and successfully navigate the show floor, earning first place and $1,000 for each team member.

The winning team included:

• Meyhun Bhatt, Virginia Tech
• Lucian Chung, San Jose State University
• Baylynne Keen, Virginia Tech

Taking second place, Team 2 demonstrated strong collaboration, quick thinking, and technical knowledge throughout the race. Each team member received $500.

The second-place team included:

• Malia Calitis, Rochester Institute of Technology`
• Jack Rice, Clemson University
• Kayla Quach, San Jose State University
• Lindsay Stouch, Rutgers University
• Tate Mcouat, Clemson University

Rounding out the top three, Team 10 earned third place after demonstrating resourcefulness, teamwork, and determination across the competition. Each team member received $250.

The third-place team included:

• Tatum Pratt, Virginia Tech
• Madison Lott, Tuskegee University
• Ray Hudock, Rochester Institute of Technology
• Reese Wiethoff, Clemson University

“The Amazing Packaging Race gives students an opportunity to take what they are learning in the classroom and put it into action while experiencing the packaging and processing industry firsthand,” says Kate Torrence, director, workforce development, PMMI. “Beyond the competition, students are meeting industry professionals, interacting with real technologies, and seeing the range of career opportunities available to them. The energy and talent they bring to the show floor offer an exciting glimpse at the future of our industry.”

"One of the things I enjoy most about this industry is seeing how the decisions we make ultimately impact the people around us. From the products on store shelves to the packages arriving at our doors, there's an incredible amount of innovation happening behind the scenes,” says Kevin Welsch, manager, marketing strategy, SICK Sensor Intelligence. “SICK is proud to support the Amazing Packaging Race because these students are the future of manufacturing and automation, and helping develop that talent is an investment in all of our futures."

The Amazing Packaging Race is designed to give college students an experience that extends beyond the classroom. By completing challenges at exhibitor booths throughout PACK EXPO International, participants interact directly with packaging and processing equipment, technologies, suppliers, and industry professionals.

For many students, the competition also provides an opportunity to explore potential career paths, build professional connections, and experience the breadth of an industry that relies on engineering, automation, manufacturing, technology, and problem-solving expertise.

The 2026 Amazing Packaging Race would not have been possible without the support of participating exhibitors, who hosted challenges and engaged directly with students throughout the competition.

2026 Participating Exhibitors

• All-Fill Inc.
• B&R Industrial Automation
• Beckhoff Automation
• BW Packaging
• Carleton Helical Technologies
• CMCO Conveyance Solutions
• Cold Pressure Council (CPC)
• Delta Modtech
• Duravant
• Econocorp Inc
• Fallas Automation Inc.
• FOX IV Technologies, Inc.
• Fresh-Lock By Presto Products
• HARPAK-ULMA Packaging, LLC
• HEISLER Industries, Inc.
• Hoosier Feeder
• Institute of Packaging Professionals, IoPP
• LinMot USA
• Morrison Container Handling Solutions
• OMAC
• PAC Machinery
• Pacteon Group
• Pepperl+Fuchs
• Rinco Ultrasonics USA, Inc.
• Shurtape Technologies
• SICK
• Siemens Digital Industries
• Starview Packaging Machinery
• Triangle Package Machinery Company

PMMI looks forward to welcoming students once again to the Amazing Packaging Race in 2027 at PACK EXPO Las Vegas. To learn more about PMMI’s Student Opportunities at PACK EXPO, visit packexpointernational.com/education/student-opportunities.

PMMI offers many student opportunities and workforce development programs. For more information, visit PMMI.org/workforce.

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