The Future of Manufacturing Takes the Stage at PACK EXPO International 2026

HERNDON, Virginia; Oct. 8, 2026 — The next generation of packaging and processing professionals won’t just be watching from the sidelines at PACK EXPO International 2026 — they’ll be building machines, demonstrating robots, racing across the show floor, meeting potential employers, and exploring careers in one of manufacturing’s most dynamic industries.

Taking place Oct. 18–21 at McCormick Place in Chicago, PACK EXPO International will bring students face-to-face with the technologies, companies, and professionals shaping the future of packaging and processing. Through hands-on competitions, demonstrations, tours, career development opportunities, and networking, students can experience the industry in action while beginning to build connections for their own futures.

Educational opportunities for students include:

• PACK Challenge: Six high school teams face off in a machine-building showdown. These teams earned their spot in the qualifiers with inventive designs and are now ready to compete in tasks such as Factory Acceptance Test, sales and marketing, and operator training. Teams may win up to $20,000. Teams include:
  
  • Alexandria Area High School
  • Legacy Christian Academy and Becker High School Coalition
  • Rich Township High School
  • Sartell High School
  • South Shore Technical High School
  • Waterford Union High School

• Future Innovators Robotics Showcase, sponsored by Schneider Electric: See high school robotics teams showcase their design, engineering, and troubleshooting skills with live demonstrations. Participating teams include:
  
  • Armada Robotics (FRC 2508)
  • Charger Robotics (FRC 5348)
  • First Starforce (FRC 11173)
  • Gear Wizards (FTC 16917)
  • Golden Ratio Robotics (FTC 12882)
  • Monty Pythons (FRC 2151)
  • Random Engineers (FTC 23802)
  • Sartell Robotics (FRC 6045)
  • Sensory Overload (FTC 25956)
  • That ONE Team - Our Next Engineers (FRC 4967)
    
• Students PACK the EXPO: Students from local Chicago-area schools will take to the show floor to experience PACK EXPO International through a virtual scavenger hunt, student tours, and a lunch-and-learn session.
  
• Amazing Packaging Race, sponsored by SICK, Inc.: In this fun and educational event, teams from colleges and universities across North America race around the show floor to complete a series of tasks at participating exhibitor booths in a thrilling race. Participating exhibitors include:
  
  • All-Fill Inc.
  • B&R Industrial Automation
  • Beckhoff Automation
  • BW Packaging
  • Carleton Helical Technologies
  • CMCO Conveyance Solutions
  • Cold Pressure Council (CPC)
  • Delta Modtech
  • Duravant
  • Econocorp Inc
  • Fallas Automation Inc.
  • FOX IV Technologies, Inc.
  • Fresh-Lock By Presto Products
  • HARPAK-ULMA Packaging, LLC
  • HEISLER Industries, Inc.
  • Hoosier Feeder
  • Institute of Packaging Professionals, IoPP
  • LinMot USA
  • Morrison Container Handling Solutions
  • OMAC
  • PAC Machinery
  • Pacteon Group
  • Pepperl+Fuchs
  • Rinco Ultrasonics USA, Inc.
  • Shurtape Technologies
  • SICK
  • Siemens Digital Industries
  • Starview Packaging Machinery
  • Triangle Package Machinery Company
    
• The Workforce Development Pavilion serves as the ultimate resource hub for strengthening the existing workforce and nurturing the future workforce. Attendees can explore PMMI U's array of offerings, including sought-after training workshops. Colleges and universities will showcase their mechatronics, packaging, and processing programs, while companies will have the opportunity to engage with students interested in pursuing careers in the industry. Participating schools include:
  
  • Brigham Young University - Idaho
  • Cal Poly Packaging
  • Clemson University Packaging Science
  • Fresno State University
  • Hennepin Tech College
  • Illinois Tech – Food Science and Nutrition Department
  • Indiana State University
  • Michigan State University School of Packaging
  • North Carolina State University
  • Northwood Technical College
  • Purdue University Northwest
  • Rochester Institute of Technology
  • Rutgers Packaging Engineering Program
  • San Jose State University
  • Toronto Metropolitan University
  • Tuskegee University
  • University of Florida
  • University of Wisconsin – Stout
  • Virginia Tech

Additional networking opportunities for students include:

• Student Tours: PMMI staff will conduct tours of the show floor Sunday and Monday at 3:30 p.m. Tours start at the PMMI U and PMMI Foundation Booth.
• Student Lounge: Open for students to meet with HR professionals to discuss career opportunities, receive resume-writing tips, and attend interview workshops. Interview Workshops will be conducted on Monday, Tuesday, and Wednesday at 1:00 p.m. and on Tuesday and Wednesday at 10:00 a.m.
• Packaging & Processing Women’s Leadership Network (PPWLN) Breakfast: Students attending PACK EXPO International are invited to attend the PPWLN Breakfast on Tuesday, Oct. 20.
• Tour with PPWLN Executive Council: Following the PPWLN Breakfast, members of the PPWLN Executive Council will provide a guided tour for the students.

“PACK EXPO International is a place where students can connect with future employers and glimpse the real-world machinery, challenges, and solutions they may encounter in a career,” says Kate Torrence, director, workforce development, PMMI. “By bringing these opportunities to students, we are investing in the future of our industries and preparing a skilled next-generation workforce.”

As the largest packaging and processing industry event in North America, PACK EXPO International is set to feature over 2,700 exhibitors across 1.3 million net square feet, with 48,000 attendees from across 40+ vertical markets.

For more details on student opportunities at the show, visit https://www.packexpointernational.com/education/student-opportunities.

To register for the show, go to packexpointernational.com.

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